Power Semiconductor Device Packaging Substrate
- Min. Order:
- 50 Piece/Pieces
- Min. Order:
- 50 Piece/Pieces
- Transportation:
- Ocean, Air, Express
- Port:
- SHANGHAI, NINGBO
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Contact Now| Place of Origin: | CHINA |
|---|---|
| Payment Type: | T/T |
| Incoterm: | CIF,FOB,EXW |
| Certificate: | ISO9001:2015 / ISO14001:2015 |
| HS Code: | 8534009000 |
| Transportation: | Ocean,Air,Express |
| Port: | SHANGHAI,NINGBO |
Power Semiconductor Device Packaging Substrate
We are the best supplier and manufacturer of flexible substrate in China, we can customize the double-sided etching with different graphics according to the customer's drawings. We are equipped with professional metal etching equipment and exposure development equipment. Our etching process can achieve neat alignment, no peeling, no incompleteness, no air holes, no inclusions and other appearance defects. Usually, the material for etching flexible substrate is PE based double-sided copper cladding. It is mainly used in high-end car seats, car cold cup, car refrigerator, head display, car power and other fields.
Below are the specific parameters of this product, please check more semiconductor chip carrier in our website for more ideas.
|
MATERIAL |
PE Base Double-sided Copper Clad |
|
COPPER CLADDING THICKNESS |
0.3mm |
|
PRODUCT FEATURES |
Customizable double-sided etching with different graphics according to design Neatly Arranged, No Peeling, No Incomplete, No Air Holes, No Inclusions and Other Appearance Defects |
|
TECHNICAL CAPABILITY |
Minimum Pitch 0.5mm Manufacturing Capability Side Etching 0mm - 0.1mm |
|
SURFACE TREATMENT |
Anti-Oxidation, Silver Plating, Nickel Plating, Gold Plating |
CERAMIC SUBSTRATE PIC
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