
High Temperature Stability Flexible Substrate for Car Seat
- Min. Order:
- 50 Piece/Pieces
- Min. Order:
- 50 Piece/Pieces
- Transportation:
- Ocean, Air, Express
- Port:
- Ningbo, Shanghai
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Contact NowPlace of Origin: | China |
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Payment Type: | T/T |
Incoterm: | FOB,CIF,EXW |
Certificate: | ISO9001:2015 / ISO14001:2015 |
HS Code: | 8534009000 |
Transportation: | Ocean,Air,Express |
Port: | Ningbo,Shanghai |
High Temperature Stability Flexible Substrate for Car Seat
Precision etching of Semiconductor Chip Carrier refers to the process of selectively removing material from the chip carrier to create precise patterns or features. This can be done using various etching techniques such as wet etching or dry etching.
The semiconductor chip carrier is a package that houses the semiconductor chip and provides electrical connections to the external circuitry. It is typically made of a material such as ceramic or plastic, and it may have metal traces or pads for connecting the chip to the outside world.
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1. High Temperature Stability: Semiconductor ceramic substrates exhibit excellent high-temperature stability, enabling them to maintain reliable performance in high-temperature operating environments, making them suitable for high-temperature applications.
2. Excellent Insulating Properties: Semiconductor ceramic substrates have superior insulating properties, effectively isolating currents to prevent leakage and interference, thereby enhancing device reliability and stability.
3. Low Thermal Expansion Coefficient: Semiconductor ceramic substrates possess a low thermal expansion coefficient, ensuring dimensional stability even with temperature fluctuations, reducing the impact of temperature changes on devices.
4. Good Thermal Conductivity: Semiconductor ceramic substrates feature good thermal conductivity, helping to efficiently dissipate the heat generated by devices, preventing overheating damage.
5. High Mechanical Strength: Semiconductor ceramic substrates have sufficient mechanical strength to withstand mechanical stress and vibrations during assembly and transportation, reducing the risk of device damage.
6. Flatness and Precise Dimensions: Semiconductor ceramic substrates maintain a flat surface and precise dimensions, ensuring good contact and connections between devices.
7. Corrosion Resistance: Semiconductor ceramic substrates exhibit excellent corrosion resistance, resisting damage from chemical substances, thereby increasing device lifespan.
8. Multilayer Structure: Some semiconductor ceramic substrates adopt a multilayer structure, achieving higher circuit density and functional integration, catering to the demand for high-density integrated circuits.
9. Customizability: Semiconductor ceramic substrates can be custom-designed according to customer requirements, meeting specific needs in various application fields and devices.
10. Environmentally Friendly: Semiconductor ceramic substrates are manufactured using environmentally friendly materials, complying with environmental regulations and contributing to green production and sustainable development.
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