Etching 0.3mm Double-sided Copper Clad Flexible Substrate

As the structural support and optical signal transmission pathway and medium, flexible substrates are playing ever-increasingly important roles in advanced optoelectronic display devices. The use of flexible substrates will significantly reduce the weight of flat panel displays and provide the ability to conform, bend or roll a display into any shape. Moreover, it will open up the possibility of fabricating displays by continuous roll processing, thus providing the basis for cost-effective mass production. Flexible substrate usually used in thermoelectric refrigerator accessories, high-end car seats, car cold cup, car refrigerator, head display, car power, home appliances, medical devices, semiconductor chips, laser projection, optical device packaging in optical fiber communication and other fields. 

Currently, there are mainly three types of candidates for flexible substrates: ultrathin glass, metal foil, and plastic (polymer) films. The material we use in Flexible Substrate is PE base double-sided copper clad, the thickness of copper clad is 0.3 mm. We are equipped with professional metal etching equipment and exposure development equipment. We use fine etching process and manufactures, we can guarantee that our etched and machined products can achieve Double-sided etching of different graphics, alignment, neatly arranged, and no shedding, no incomplete, no pores, no inclusions and other appearance defects.

Below are the specific parameters of this product, please check more semiconductor chip carrier in our website for more ideas.

Flexible Substrate PIC